HFCL Partners with Taiwanese MediaTek to Integrate T750 Chipset into Indoor 5G FWA CPE

HFCL has entered into a partnership with Taiwanese fabless chipmaker MediaTek to integrate the HFCL 5G indoor consumer premises equipment (CPE) with the MediaTek T750 chipset, as announced by the homegrown telecom gear maker on Tuesday. The MediaTek T750 chipset, fabricated on a 7nm architecture, features a 5G radio and quad-core Arm CPU, ensuring seamless connectivity across multiple devices with dual-band 4×4 Wi-Fi 6 support. The HFCL 5G indoor CPE is equipped with a 2.5Gbps Ethernet interface for high-speed data transfer and also supports embedded eSIM. Additionally, the CPE, designed as a plug-and-play device, includes an AI-integrated mobile app, with zero-touch management and operational features allowing for automated provisioning and remote upgrades. 

Evan Su, General Manager of Wireless Communications at MediaTek, expressed enthusiasm about the collaboration, stating that HFCL’s ‘made-in-India’ 5G FWA Indoor CPE, powered by the MediaTek T750 chip, will enable customers to experience 5G FWA connectivity on a global scale. He emphasized that the partnership represents another milestone in supporting the Indian government’s vision of fostering a sustainable telecom ecosystem through local manufacturing. The HFCL 5G FWA indoor CPE supports both Standalone (SA) and Non-standalone (NSA) technologies across various frequency bands, offering connectivity with fiber-like speeds wirelessly. 

Mahendra Nahata, Managing Director of HFCL, lauded the collaboration with MediaTek, a leading global fabless semiconductor company, in incorporating its state-of-the-art 7nm compact chipset into the revolutionary HFCL 5G FWA Indoor CPE. Nahata highlighted the device’s ability to assist telecom operators in addressing last-mile connectivity challenges while providing a fiber-like experience to both consumers and enterprises. According to third-party market estimates cited by HFCL, the global 5G last-mile equipment market is projected to reach $68 billion by 2030. The company is currently showcasing its indoor 5G FWA CPE at the Mobile World Congress 2024 (MWC 2024) in Barcelona, Spain

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